Three-Dimensional Passive Elements for Compact GaAs MMICs

Makoto HIRANO  Yuhki IMAI  Ichihiko TOYODA  Kenjiro NISHIKAWA  Masami TOKUMITSU  Kazuyoshi ASAI  

Publication
IEICE TRANSACTIONS on Electronics   Vol.E76-C   No.6   pp.961-967
Publication Date: 1993/06/25
Online ISSN: 
DOI: 
Print ISSN: 0916-8516
Type of Manuscript: Special Section PAPER (Special Issue on Microwave and Millimeter-Wave Technology for Advanced Functions and Size-Reductions)
Category: 
Keyword: 
three-dimensional,  passive elements,  GaAs,  MMICs,  

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Summary: 
Novel three-dimensional structures for passive elements--inductors, capacitors, transmission lines, and airbridges--have been developed to reduce the area they consume in GaAs MMICs. These structures can be formed with a simple technology by electroplating along the sidewalls of a photoresist. Adopting the new structures, most passive elements in MMICs have been shrunk to less than 1/4 the size of conventional ones.