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Three-Dimensional Passive Elements for Compact GaAs MMICs
Makoto HIRANO Yuhki IMAI Ichihiko TOYODA Kenjiro NISHIKAWA Masami TOKUMITSU Kazuyoshi ASAI
IEICE TRANSACTIONS on Electronics
Publication Date: 1993/06/25
Print ISSN: 0916-8516
Type of Manuscript: Special Section PAPER (Special Issue on Microwave and Millimeter-Wave Technology for Advanced Functions and Size-Reductions)
three-dimensional, passive elements, GaAs, MMICs,
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Novel three-dimensional structures for passive elements--inductors, capacitors, transmission lines, and airbridges--have been developed to reduce the area they consume in GaAs MMICs. These structures can be formed with a simple technology by electroplating along the sidewalls of a photoresist. Adopting the new structures, most passive elements in MMICs have been shrunk to less than 1/4 the size of conventional ones.