Publication IEICE TRANSACTIONS on ElectronicsVol.E76-CNo.4pp.532-540 Publication Date: 1993/04/25 Online ISSN: DOI: Print ISSN: 0916-8516 Type of Manuscript: Special Section PAPER (Special Issue on Sub-Half Micron Si Device and Process Technologies) Category: Device Technology Keyword: MOS transistor, shallow junction, salicide, titanium,
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Summary: A novel CMOS structure has been developed using Ti-salicide PSD transistor formed by a new self-aligned method. Both N-channel and P-channel PSD transistors exhibit excellent short-channel behaviors down to the sub-half-micrometer region with shallow S/D junctions formed by dopant diffusion from polysilicons. New salicide process has been developed for the PSD structure and can effectively reduce the sheet resistances of the S/D polysilicon and the polysilicon gate to as low as 45Ω/. As a result, the low resistive local interconnects can be successfully implemented by the Ti-salicide S/D polysilicon merged with contacts by self-alignment. More-over it is found that shallow Ti-salicide S/D junctions with the PSD structure can achieve approximately 12 orders of magnitude lower area leakage current than that of the conventional implanted S/D junctions by eliminating implanted damage and preventing penetration of silicide into junctions with the elevated structure of S/D polysilicon layer. Furthermore CMOS ring oscillators having PSD transistors with an effective channel length of 0.4 µm were fabricated using the salicided S/D polysilicon as a local interconnect between the N+ and the P+ regions, and successfully operated with a propagation delay time of 50 ps/stage at a supply voltage of 5 V.