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Evaluation of Bonding Silicon-on-Insulator Films with Deep-Level Transient Spectroscopy Measurements
Akira USAMI Taichi NATORI Akira ITO Shun-ichiro ISHIGAMI Yutaka TOKUDA Takao WADA
IEICE TRANSACTIONS on Electronics
Publication Date: 1992/09/25
Print ISSN: 0916-8516
Type of Manuscript: Special Section PAPER (Special Issue on Silicon Devices and Materials)
bonding SOI, DLTS, thermal donor, C-V, void,
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Silicon-on-insulator (SOI) films fabricated by the wafer bonding technique were studies with capacitance-voltage (C-V) and deep-level transient spectroscopy (DLTS) measurements. For our expereiments, two kinds of SOI wafers were prepared. Many voids were present in one sample (void sample), but few voids were in the other sample (no void sample). Before annealing, two DLTS peaks (Ec-0.48 eV and Ec-0.38 eV) were observed in the SOI layer of the void sample. For the no void sample, different two DLTS peaks (Ec-0.16 eV and Ec-0.12 eV) were observed. The trap with an activation energy of 0.48 eV was annealed out after 450 annealing for 24 h. On the other hand, other traps were annealed out after 450 annealing for several hours. During annealing at 450, thermal donors (TDs) were formed simultaneously. In usual CZ silicon, a DLTS peak of TD was observed around 60 K. In the no void sample, however, a TD peak was observed at a temperature lower than 30 K. This TD was annihilated by rapid thermal annealing. This suggests that the TD with a shallower level was formed in the no void sample after annealing at 450.