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1/5 Power Law in PN-Junction Failure Mechanism Caused by Electrical-Over-Stress
Yutaka TAJIMA Kunihiro ASADA Takuo SUGANO
IEICE TRANSACTIONS on Electronics
Publication Date: 1992/02/25
Print ISSN: 0916-8516
Type of Manuscript: Special Section PAPER (Special Issue on Selected Papers from '91 VPAD)
reliability, failure, pn-junction, silicon, electrostatic-discharge,
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We have developed a new model to analyze the thermal failure mechanism due to electrical-over-stress (EOS) for two-dimensional planar pn-junction structures where the failure power is proportional to about 1/5 power of the failure time. We adopted a pseudo two-dimensional numerical simulation method where a pn-junction diode is divided into small elements and represented by a circuit network composed of many minute resistors and diodes. The failure mechanism studied by Wunsch and Bell, that is one of many studies for one-dimensional pn-diodes, is not valid for the case of two-dimensional pn-junction, such as a planar type junction. On the contrary, the failure mechanism was found to be much correlative with the junction structure, especially the impurity concentration in the substrate in the two-dimensional case. When the impurity concentration in the substrate is high enough (e.g. Nsub1017[cm-3]), the breakdown occurs at the whole junction. The heat transfer is one-dimensional and the failure power is proportional to about 1/2 power of the failure time, which is well known results reported by many researchers: e.g. Wunsch &Bell. On the other hand, when the impurity concentration in the substrate is low enough (e.g. Nsub1016[cm-3]), the breakdown occurs locally at the junction edge. The heat transfer is two-dimensional and the failure power is in proportion to about 1/5 power of the failure time.