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A Method of Obtaining the Maximum Likelihood Initial Height Function for Optimal Movement of a Wire Bonder
Shengping JIANG Hiroyuki ANZAI
Publication
IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Vol.E75A
No.9
pp.11341140 Publication Date: 1992/09/25 Online ISSN:
DOI: Print ISSN: 09168508 Type of Manuscript: PAPER Category: Computer Aided Design (CAD) Keyword: maximum likelihood model, initial height function, surface, AIC method, wire bonder,
Full Text: PDF>>
Summary:
In this paper, we propose a method to simulate the curve surface of the initial height in the movement of the electronic wire bonder using the experimental data. For given measured data (x_{k}, y_{k}, z_{k} (k=1, 2, , m)), we propose an algebraic surface of nth degree as a methematical model of the initial height surface. The AIC method is a method of evaluating the goodness of a given model. The maximum likelihood model is selected by comparing with the AIC value of each model for n=0, 1, 2, 3, , 11. Useing this model, the initial raise position of the electronic wire bonder can be controlled by computer programing and can make the movement of wire bonder fullautomatic. As a resurt, the wellarranged wiring and reliable contacting can be obtained.


