A Method of Obtaining the Maximum Likelihood Initial Height Function for Optimal Movement of a Wire Bonder

Shengping JIANG  Hiroyuki ANZAI  

Publication
IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences   Vol.E75-A    No.9    pp.1134-1140
Publication Date: 1992/09/25
Online ISSN: 
DOI: 
Print ISSN: 0916-8508
Type of Manuscript: PAPER
Category: Computer Aided Design (CAD)
Keyword: 
maximum likelihood model,  initial height function,  surface,  AIC method,  wire bonder,  

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Summary: 
In this paper, we propose a method to simulate the curve surface of the initial height in the movement of the electronic wire bonder using the experimental data. For given measured data (xk, yk, zk (k=1, 2, , m)), we propose an algebraic surface of n-th degree as a methematical model of the initial height surface. The AIC method is a method of evaluating the goodness of a given model. The maximum likelihood model is selected by comparing with the AIC value of each model for n=0, 1, 2, 3, , 11. Useing this model, the initial raise position of the electronic wire bonder can be controlled by computer programing and can make the movement of wire bonder full-automatic. As a resurt, the well-arranged wiring and reliable contacting can be obtained.