LSI Packaging Technology for Mainframe Computers

Kenji TAKEDA  Masahide HARADA  Tsuyoshi FUJITA  Takashi INOUE  

Publication
IEICE TRANSACTIONS on Electronics   Vol.E74-C   No.8   pp.2337-2343
Publication Date: 1991/08/25
Online ISSN: 
DOI: 
Print ISSN: 0916-8516
Type of Manuscript: Special Section PAPER (Special Issue on Advanced Packaging Technology for Microelectronics Manufacturing)
Category: Packaging Technology for Main Frame
Keyword: 


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Summary: 
This paper describes the innovation in single chip package design for mainframe computers coupled with major advances in "Controlled Collapse Chip Connection (C4)" technology, multilayer ceramic technology, and thin-film technology. C4 technology allows the LSI chips to be connected with high integration and high-performance. Applying C4 technology to chip-to-package and package-to-module interconnections provides a higher level of connection pads out from a small package. A new material 96.5 Sn/3.5 Ag for solder joints has been developed to facilitate reliable interconnection where thermal fatigue might have been a problem. The microstructure of a fractured surface and the estimation based on "Finite Element Method (FEM)" are correlated. New material and a process of mullite-glass has been developed to attain a thermal expansion coefficient close to that of silicon. The metallized ceramic technology for the mullite-glass can be applied to the substrate of LSI packages as well as multilayer ceramic multi-chip modules. Thin-film technology has been studied to form high-density wiring on package substrates. Using photolithography technique, it is possible to pattern pads accurately enough for connection to an LSI chip. The polyimide-Al combination can be patterned by subtractive technique using liquid etchants and sputtering. The via formation process is simplified using a photosensitive polyimide so that the fabrication process for multilayer wiring becomes suitable for mass production. Hitachi recently announced the HITAC M-880 Processor Unit which makes extensive use of these technologies. The general features of the LSI package "Micro Carrier for LSI Chip (MCC)" is also outlined.