Progress of H2S Gas Corrosion and Contact Resistance Properties for Contact Surface of Printed Circuit Board

Terutaka TAMAI  Tsunemi MORIYA  

IEICE TRANSACTIONS (1976-1990)   Vol.E73   No.4   pp.499-502
Publication Date: 1990/04/25
Online ISSN: 
Print ISSN: 0000-0000
Type of Manuscript: Special Section LETTER (Special Issue on 1990 Spring National Convention IEICE)
Category: Electromechanical Components

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Progress of corrosion of contact surfaces on the printed circuit board both for thin Au plated (0.1µm) and for thick solder plated (10µm) were examined in H2S environment. The corrosion was evaluated by thickness of contaminant film and contact resistance. The Au plated surface easily degraded by pore corrosion. On the other hand, the film on the solder plated surface grew very slowly. For the solder plated surface, acceptable low contact resistance which corresponds to the low growth rate of the film was found.