Characterization of Multi-Layer Ceramic Chip Capacitors up to mm-Wave Frequencies for High-Speed Digital Signal Coupling

Tsugumichi SHIBATA  Yoshito KATO  

Publication
IEICE TRANSACTIONS on Electronics   Vol.E103-C   No.11   pp.575-581
Publication Date: 2020/11/01
Publicized: 2020/04/09
Online ISSN: 1745-1353
DOI: 10.1587/transele.2019ESP0004
Type of Manuscript: Special Section PAPER (Special Section on Recent Advances in Simulation Techniques and Their Applications for Electronics)
Category: 
Keyword: 
coupling capacitance,  MLCC,  high-speed digital signal,  mm-waves,  

Full Text: FreePDF


Summary: 
Capacitive coupling of line coded and DC-balanced digital signals is often used to eliminate steady bias current flow between the systems or components in various communication systems. A multi-layer ceramic chip capacitor is promising for the capacitor of very broadband signal coupling because of its high frequency characteristics expected from the downsizing of the chip recent years. The lower limit of the coupling bandwidth is determined by the capacitance while the higher limit is affected by the parasitic inductance associated with the chip structure. In this paper, we investigate the coupling characteristics up to millimeter wave frequencies by the measurement and simulations. A phenomenon has been found in which the change in the current distribution in the chip structure occur at high frequencies and the coupling characteristics are improved compared to the prediction based on the conventional equivalent circuit model. A new equivalent circuit model of chip capacitor that can express the effect of the improvement has been proposed.