Design of a 45 Gb/s, 98 fJ/bit, 0.02 mm2 Transimpedance Amplifier with Peaking-Dedicated Inductor in 65-nm CMOS

Akira TSUCHIYA  Akitaka HIRATSUKA  Kenji TANAKA  Hiroyuki FUKUYAMA  Naoki MIURA  Hideyuki NOSAKA  Hidetoshi ONODERA  

IEICE TRANSACTIONS on Electronics   Vol.E103-C    No.10    pp.489-496
Publication Date: 2020/10/01
Publicized: 2020/04/09
Online ISSN: 1745-1353
DOI: 10.1587/transele.2019CTP0008
Type of Manuscript: Special Section PAPER (Special Section on Analog Circuits and Their Application Technologies)
Category: Integrated Electronics
optical communication,  transimpedance amplifier,  inductive peaking,  on-chip inductor,  

Full Text: PDF(2.2MB)>>
Buy this Article

This paper presents a design of CMOS transimpedance amplifier (TIA) and peaking inductor for high speed, low power and small area. To realize high density integration of optical I/O, area reduction is an important figure as well as bandwidth, power and so on. To determine design parameters of multi-stage inverter-type TIA (INV-TIA) with peaking inductors, we derive a simplified model of the bandwidth and the energy per bit. Multi-layered on-chip inductors are designed for area-effective inductive peaking. A 5-stage INV-TIA with 3 peaking inductors is fabricated in a 65-nm CMOS. By using multi-layered inductors, 0.02 mm2 area is achieved. Measurement results show 45 Gb/s operation with 49 dBΩ transimpedance gain and 4.4 mW power consumption. The TIA achieves 98 fJ/bit energy efficiency.