Fingertip-Size Optical Module, “Optical I/O Core”, and Its Application in FPGA

Takahiro NAKAMURA
Kenichiro YASHIKI
Kenji MIZUTANI
Takaaki NEDACHI
Junichi FUJIKATA
Masatoshi TOKUSHIMA
Jun USHIDA
Masataka NOGUCHI
Daisuke OKAMOTO
Yasuyuki SUZUKI
Takanori SHIMIZU
Koichi TAKEMURA
Akio UKITA
Yasuhiro IBUSUKI
Mitsuru KURIHARA
Keizo KINOSHITA
Tsuyoshi HORIKAWA
Hiroshi YAMAGUCHI
Junichi TSUCHIDA
Yasuhiko HAGIHARA
Kazuhiko KURATA

Publication
IEICE TRANSACTIONS on Electronics   Vol.E102-C    No.4    pp.333-339
Publication Date: 2019/04/01
Online ISSN: 1745-1353
DOI: 10.1587/transele.2018ODI0005
Type of Manuscript: Special Section INVITED PAPER (Special Section on Progress in Optical Device Technology for Increasing Data Transmission Capacity)
Category: 
Keyword: 
silicon photonics,  bandwidth density,  optical/electrical assembly,  FPGA,  

Full Text: FreePDF

Summary: 
Optical I/O core based on silicon photonics technology and optical/electrical assembly was developed as a fingertip-size optical module with high bandwidth density, low power consumption, and high temperature operation. The advantages of the optical I/O core, including hybrid integration of quantum dot laser diode and optical pin, allow us to achieve 300-m transmission at 25Gbps per channel when optical I/O core is mounted around field-programmable gate array without clock data recovery.