Fingertip-Size Optical Module, “Optical I/O Core”, and Its Application in FPGA

Takahiro NAKAMURA  Kenichiro YASHIKI  Kenji MIZUTANI  Takaaki NEDACHI  Junichi FUJIKATA  Masatoshi TOKUSHIMA  Jun USHIDA  Masataka NOGUCHI  Daisuke OKAMOTO  Yasuyuki SUZUKI  Takanori SHIMIZU  Koichi TAKEMURA  Akio UKITA  Yasuhiro IBUSUKI  Mitsuru KURIHARA  Keizo KINOSHITA  Tsuyoshi HORIKAWA  Hiroshi YAMAGUCHI  Junichi TSUCHIDA  Yasuhiko HAGIHARA  Kazuhiko KURATA  

Publication
IEICE TRANSACTIONS on Electronics   Vol.E102-C   No.4   pp.333-339
Publication Date: 2019/04/01
Online ISSN: 1745-1353
DOI: 10.1587/transele.2018ODI0005
Type of Manuscript: INVITED PAPER (Special Section on Progress in Optical Device Technology for Increasing Data Transmission Capacity)
Category: 
Keyword: 
silicon photonics,  bandwidth density,  optical/electrical assembly,  FPGA,  

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Summary: 
Optical I/O core based on silicon photonics technology and optical/electrical assembly was developed as a fingertip-size optical module with high bandwidth density, low power consumption, and high temperature operation. The advantages of the optical I/O core, including hybrid integration of quantum dot laser diode and optical pin, allow us to achieve 300-m transmission at 25Gbps per channel when optical I/O core is mounted around field-programmable gate array without clock data recovery.