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Simulation of Temperature Distribution under Periodic Heating for Analysis of Thermal Diffusivity in Nanometer-Scale Thermoelectric Materials
Naomi YAMASHITA Yuya OTA Faiz SALLEH Mani NAVANEETHAN Masaru SHIMOMURA Kenji MURAKAMI Hiroya IKEDA
IEICE TRANSACTIONS on Electronics
Publication Date: 2018/05/01
Online ISSN: 1745-1353
Type of Manuscript: BRIEF PAPER
thermal diffusivity, ac calorimetry, heat diffusion equation, AlN,
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With the aim of characterizing the thermal conductivity for nanometer-scale thermoelectric materials, we have constructed a new measurement system based on ac calorimetry. Analysis of the obtained data requires time-evolution of temperature distribution in nanometer-scale material under periodic heating. In this study, we made a simulation using a C#-program for time-dependent temperature distribution, based on 2-dimensional heat-diffusion equation including the influence of heat emission from material edges. The simulation was applied to AlN with millimeter-scale dimensions for confirming the validity and accuracy. The simulated thermal diffusivity for 10×75-mm2-area AlN was 1.3×10-4 m2/s, which was larger than the value set in the heat-diffusion equation. This overestimation was also observed in the experiment. Therefore, our simulation can reproduce the unsteady heat conduction and be used for analyzing the ac calorimetry experiment.