Keyword : within-die parameter variation

Design Guidelines and Process Quality Improvement for Treatment of Device Variations in an LSI Chip
Masakazu AOKI Shin-ichi OHKAWA Hiroo MASUDA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2005/05/01
Vol. E88-C  No. 5 ; pp. 788-795
Type of Manuscript:  Special Section PAPER (Special Section on Microelectronic Test Structures)
within-die parameter variationrandom variationsystematic variationcorrelation lengthfitting function
 Summary | Full Text:PDF