Keyword : wire bonder


A Method of Obtaining the Maximum Likelihood Initial Height Function for Optimal Movement of a Wire Bonder
Shengping JIANG Hiroyuki ANZAI 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 1992/09/25
Vol. E75-A  No. 9 ; pp. 1134-1140
Type of Manuscript:  PAPER
Category: Computer Aided Design (CAD)
Keyword: 
maximum likelihood modelinitial height functionsurfaceAIC methodwire bonder
 Summary | Full Text:PDF