Keyword : via placement


Redundant Vias Insertion for Performance Enhancement in 3D ICs
Xu ZHANG Xiaohong JIANG Susumu HORIGUCHI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2008/04/01
Vol. E91-C  No. 4 ; pp. 571-580
Type of Manuscript:  Special Section PAPER (Special Section on Advanced Technologies in Digital LSIs and Memories)
Category: 
Keyword: 
3D ICredundant viasvia placementdelaysignal integrityimpedance matching
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