Keyword : vertical bus line


A New Concept of 3-Dimentional Multilayer-Stacked System-in-Package for Software-Defined-Radio
Kazuo TSUBOUCHI Michio YOKOYAMA Hiroyuki NAKASE 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2001/12/01
Vol. E84-C  No. 12 ; pp. 1730-1734
Type of Manuscript:  Special Section PAPER (Special Issue on Integrated Systems with New Concepts)
Category: 
Keyword: 
system-in-packagewireless communicationflip-chip bump bonding3-D stacked packagevertical bus line
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