Keyword : three dimensional integrated circuits

Lagrangian Relaxation Based Inter-Layer Signal Via Assignment for 3-D ICs
Song CHEN Liangwei GE Mei-Fang CHIANG Takeshi YOSHIMURA 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2009/04/01
Vol. E92-A  No. 4 ; pp. 1080-1087
Type of Manuscript:  Special Section PAPER (Special Section on Advanced Technologies Emerging Mainly from the 21st Workshop on Circuits and Systems in Karuizawa)
three dimensional integrated circuitsthrough-the-silicon viavia assignment
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