Keyword : thermosyphon


Two-Phase Thermosyphon Cooling for High-Power Multichip Modules
Tohru KISHIMOTO Akio HARADA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1994/06/25
Vol. E77-C  No. 6 ; pp. 986-994
Type of Manuscript:  PAPER
Category: Instrumentation and Control
Keyword: 
multichip modulethermosyphonheat pipethermal managementbroadband ISDN
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