Keyword : thermal

Impact of Self-Heating in Wire Interconnection on Timing
Toshiki KANAMOTO Takaaki OKUMURA Katsuhiro FURUKAWA Hiroshi TAKAFUJI Atsushi KUROKAWA Koutaro HACHIYA Tsuyoshi SAKATA Masakazu TANAKA Hidenari NAKASHIMA Hiroo MASUDA Takashi SATO Masanori HASHIMOTO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2010/03/01
Vol. E93-C  No. 3 ; pp. 388-392
Type of Manuscript:  BRIEF PAPER
Category: 
Keyword: 
interconnect, delay variation, parasitic resistance, thermal, temperature, self-heat, SoC, 
 Summary | Full Text:PDF(221.9KB)
Thermal-Aware Incremental Floorplanning for 3D ICs Based on MILP Formulation
Yuchun MA Xin LI Yu WANG Xianlong HONG 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2009/12/01
Vol. E92-A  No. 12 ; pp. 2979-2989
Type of Manuscript:  Special Section PAPER (Special Section on VLSI Design and CAD Algorithms)
Category: Physical Level Desing
Keyword: 
3D ICs, incremental floorplanning, thermal, MILP, 
 Summary | Full Text:PDF(537.2KB)