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Thermal-Aware Incremental Floorplanning for 3D ICs Based on MILP Formulation Yuchun MA Xin LI Yu WANG Xianlong HONG | Publication: IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2009/12/01
Vol. E92-A
No. 12 ;
pp. 2979-2989
Type of Manuscript:
Special Section PAPER (Special Section on VLSI Design and CAD Algorithms)
Category: Physical Level Desing Keyword: 3D ICs, incremental floorplanning, thermal, MILP, | | Summary | Full Text:PDF(537.2KB) | |
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