Publication: IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences Publication Date: 2005/12/01 Vol. E88-ANo. 12 ;
pp. 3382-3389 Type of Manuscript: Special Section PAPER (Special Section on VLSI Design and CAD Algorithms) Category: Prediction and Analysis Keyword: thermal simulation, thermal gradient, temperature flattening, clock skew, reliability, timing,