Publication: IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2005/12/01
Vol. E88-A
No. 12 ;
pp. 3382-3389
Type of Manuscript:
Special Section PAPER (Special Section on VLSI Design and CAD Algorithms)
Category: Prediction and Analysis
Keyword:
thermal simulation, thermal gradient, temperature flattening, clock skew, reliability, timing, |