Keyword : system-in-package


60-GHz Band Copper Ball Vertical Interconnection for MMW 3-D System-in-Package Front-End Modules
Satoshi YOSHIDA Shoichi TANIFUJI Suguru KAMEDA Noriharu SUEMATSU Tadashi TAKAGI Kazuo TSUBOUCHI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2012/07/01
Vol. E95-C  No. 7 ; pp. 1276-1284
Type of Manuscript:  PAPER
Category: Microwaves, Millimeter-Waves
Keyword: 
millimeter-wave60-GHz bandsystem-in-packagevertical interconnectioncopper ballsWPAN
 Summary | Full Text:PDF(7MB)

Packaging Technology Trends and Challenges for System-in-Package
Akihiro DOHYA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2001/12/01
Vol. E84-C  No. 12 ; pp. 1756-1762
Type of Manuscript:  INVITED PAPER (Special Issue on Integrated Systems with New Concepts)
Category: 
Keyword: 
packaging technologysystem-in-packageSIPSoCCSP
 Summary | Full Text:PDF(4.1MB)

A New Concept of 3-Dimentional Multilayer-Stacked System-in-Package for Software-Defined-Radio
Kazuo TSUBOUCHI Michio YOKOYAMA Hiroyuki NAKASE 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2001/12/01
Vol. E84-C  No. 12 ; pp. 1730-1734
Type of Manuscript:  Special Section PAPER (Special Issue on Integrated Systems with New Concepts)
Category: 
Keyword: 
system-in-packagewireless communicationflip-chip bump bonding3-D stacked packagevertical bus line
 Summary | Full Text:PDF(472.4KB)