Keyword : surface-activated bonding


Room-Temperature Bonding of Wafers with Smooth Au Thin Films in Ambient Air Using a Surface-Activated Bonding Method
Eiji HIGURASHI Ken OKUMURA Yutaka KUNIMUNE Tadatomo SUGA Kei HAGIWARA 
Publication:   
Publication Date: 2017/02/01
Vol. E100-C  No. 2 ; pp. 156-160
Type of Manuscript:  INVITED PAPER (Special Section on Fabrication Technologies Supporting the Photonic/Nanostructure Devices)
Category: 
Keyword: 
heterogeneous integrationroom-temperature bondingsurface-activated bondingAu-Au bonding
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Room-Temperature Gold-Gold Bonding Method Based on Argon and Hydrogen Gas Mixture Atmospheric-Pressure Plasma Treatment for Optoelectronic Device Integration
Eiji HIGURASHI Michitaka YAMAMOTO Takeshi SATO Tadatomo SUGA Renshi SAWADA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2016/03/01
Vol. E99-C  No. 3 ; pp. 339-345
Type of Manuscript:  INVITED PAPER (Special Section on Progress towards System Nanotechnology)
Category: 
Keyword: 
heterogeneous integrationlow-temperature bondingsurface-activated bondingatmospheric-pressure plasmaoptical microsystems
 Summary | Full Text:PDF

Low-Temperature Au-to-Au Bonding for LiNbO3/Si Structure Achieved in Ambient Air
Ryo TAKIGAWA Eiji HIGURASHI Tadatomo SUGA Satoshi SHINADA Tetsuya KAWANISHI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2007/01/01
Vol. E90-C  No. 1 ; pp. 145-146
Type of Manuscript:  Special Section LETTER (Special Section on Microoptomechatronics)
Category: Micro/Nano Fabrication
Keyword: 
low-temperature bondingAu-to-Au bondingsurface-activated bondinglithium niobate/silicon structurehybrid integration
 Summary | Full Text:PDF