Keyword : stud bump


A 60 GHz-Band 3-Dimensional System-in-Package Transmitter Module with Integrated Antenna
Noriharu SUEMATSU Satoshi YOSHIDA Shoichi TANIFUJI Suguru KAMEDA Tadashi TAKAGI Kazuo TSUBOUCHI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2012/07/01
Vol. E95-C  No. 7 ; pp. 1141-1146
Type of Manuscript:  INVITED PAPER (Special Section on Recent Trends of Microwave Systems and Their Fundamental Technologies)
Category: 
Keyword: 
moduleRFICMMICantenna integrationmillimeter-waveSiPstud bump
 Summary | Full Text:PDF(6.8MB)

The Influence of Stud Bumping above the MOSFETs on Device Reliability
Nobuhiro SHIMOYAMA Katsuyuki MACHIDA Masakazu SHIMAYA Hideo AKIYA Hakaru KYURAGI 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2000/05/25
Vol. E83-A  No. 5 ; pp. 851-856
Type of Manuscript:  Special Section PAPER (Special Section on Reliability Theory and Its Applications)
Category: 
Keyword: 
stud bumpstressinterface trapshot carrierannealing
 Summary | Full Text:PDF(933.4KB)

Miniaturized Millimeter-Wave Hybrid IC Technology Using Non-Photosensitive Multi-Layered BCB Thin Films and Stud Bump Bonding
Kazuaki TAKAHASHI Hiroshi OGURA Morikazu SAGAWA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1999/11/25
Vol. E82-C  No. 11 ; pp. 2029-2037
Type of Manuscript:  INVITED PAPER (Special Issue on High-Frequency/High-Speed Devices for Information and Communication Systems in the 21st Century)
Category: RF Assembly Technology
Keyword: 
millimeter waveflip-chip bondingstud bumpmicro bumpBCBmulti-layer
 Summary | Full Text:PDF(2.6MB)