Publication: IEICE TRANSACTIONS on Electronics Publication Date: 2012/07/01 Vol. E95-CNo. 7 ;
pp. 1141-1146 Type of Manuscript: INVITED PAPER (Special Section on Recent Trends of Microwave Systems and Their Fundamental Technologies) Category: Keyword: module, RFIC, MMIC, antenna integration, millimeter-wave, SiP, stud bump,
Publication: IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences Publication Date: 2000/05/25 Vol. E83-ANo. 5 ;
pp. 851-856 Type of Manuscript: Special Section PAPER (Special Section on Reliability Theory and Its Applications) Category: Keyword: stud bump, stress, interface traps, hot carrier, annealing,
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 1999/11/25 Vol. E82-CNo. 11 ;
pp. 2029-2037 Type of Manuscript: INVITED PAPER (Special Issue on High-Frequency/High-Speed Devices for Information and Communication Systems in the 21st Century) Category: RF Assembly Technology Keyword: millimeter wave, flip-chip bonding, stud bump, micro bump, BCB, multi-layer,
