Publication: IEICE TRANSACTIONS on Electronics Publication Date: 2010/08/01 Vol. E93-CNo. 8 ;
pp. 1349-1358 Type of Manuscript: PAPER Category: Semiconductor Materials and Devices Keyword: STI, stress, model, verification, enhancement,
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 2008/07/01 Vol. E91-CNo. 7 ;
pp. 1142-1150 Type of Manuscript: PAPER Category: Semiconductor Materials and Devices Keyword: STI, stress, modeling, SPICE, layout-aware,
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 2002/03/01 Vol. E85-CNo. 3 ;
pp. 738-741 Type of Manuscript: Special Section PAPER (Special Issue on Superconductive Electronics) Category: Mixers and Detectors Keyword: SIS transmission line, resonator, optical lithography, stress, receiver noise temperature,
Publication: IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences Publication Date: 2000/05/25 Vol. E83-ANo. 5 ;
pp. 851-856 Type of Manuscript: Special Section PAPER (Special Section on Reliability Theory and Its Applications) Category: Keyword: stud bump, stress, interface traps, hot carrier, annealing,
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 1994/08/25 Vol. E77-CNo. 8 ;
pp. 1395-1403 Type of Manuscript: Special Section PAPER (Special Section on High Speed and High Density Multi Functional LSI Memories) Category: General Technology Keyword: BiCMOS, bonded SOI, double polysilicon bipolar, trench isolation, stress,
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 1992/02/25 Vol. E75-CNo. 2 ;
pp. 150-155 Type of Manuscript: Special Section PAPER (Special Issue on Selected Papers from '91 VPAD) Category: Keyword: simulation, oxidation, finite element method, stress,