Keyword : stacked packaging

Novel Stacked Packaging Structure Using Silica-Based PLC with Integrated Micro-Mirrors and Its Application to 8ch PD Array Module
Ikuo OGAWA Makoto ABE Yoshiyuki DOI Senichi SUZUKI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2005/08/01
Vol. E88-C  No. 8 ; pp. 1552-1558
Type of Manuscript:  Special Section PAPER (Special Section on Recent Development of Electro-Mechanical Devices--Selected Papers from International Session on Electro-Mechanical Devices 2004 (IS-EMD2004)--)
Category: Optical Interconnection
silica-based PLCmicro-mirrorstacked packaginghybrid integration
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