Keyword : solder bump


Constant-Magnification Varifocal Mirror and Its Application to Measuring Three-Dimensional (3-D) Shape of Solder Bump
Akira ISHII Jun MITSUDO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2007/01/01
Vol. E90-C  No. 1 ; pp. 6-11
Type of Manuscript:  INVITED PAPER (Special Section on Microoptomechatronics)
Category: 
Keyword: 
varifocal mirrorconstant magnificationshape from focus3-D shape measurementsolder bump
 Summary | Full Text:PDF

Assembly and Electrical Wiring Technologies on Planar Lightwave Circuit (PLC) Platform Providing Hybrid Integration of Optoelectronic Devices and Integrated Circuits (ICs)
Takaharu OHYAMA Yuji AKAHORI Masahiro YANAGISAWA Hideki TSUNETSUGU Shinji MINO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1999/02/25
Vol. E82-C  No. 2 ; pp. 370-378
Type of Manuscript:  Special Section PAPER (Joint Special Issue on Photonics in Switching: Systems and Devices)
Category: Assembly and Packaging Technologies
Keyword: 
PLC platformhybrid integrationsolder bumpflip-chip bondingmicrostrip line
 Summary | Full Text:PDF

Assembly and Electrical Wiring Technologies on Planar Lightwave Circuit (PLC) Platform Providing Hybrid Integration of Optoelectronic Devices and Integrated Circuits (ICs)
Takaharu OHYAMA Yuji AKAHORI Masahiro YANAGISAWA Hideki TSUNETSUGU Shinji MINO 
Publication:   IEICE TRANSACTIONS on Communications
Publication Date: 1999/02/25
Vol. E82-B  No. 2 ; pp. 422-430
Type of Manuscript:  Special Section PAPER (Joint Special Issue on Photonics in Switching: Systems and Devices)
Category: Assembly and Packaging Technologies
Keyword: 
PLC platformhybrid integrationsolder bumpflip-chip bondingmicrostrip line
 Summary | Full Text:PDF