Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 2003/03/01
Vol. E86-C
No. 3 ;
pp. 439-446
Type of Manuscript:
Special Section PAPER (Special Issue on the 2002 IEEE International Conference on Simulation of Semiconductor Processes and Devices (SISPAD'02))
Category:
Keyword:
embedded SRAM, scaling merit, 3-dimensional interconnect simulation, 50 and 70 nm technology nodes, |