Keyword : resin


Microwave-Circuit-Embedded Resin Printed Circuit Board for Short Range Wireless Interfaces
Akira SAITOU Kazuhiko HONJO Kenichi SATO Toyoko KOYAMA Koichi WATANABE 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2005/01/01
Vol. E88-C  No. 1 ; pp. 83-88
Type of Manuscript:  Special Section PAPER (Special Section on Recent Trends of Microwave and Millimeter-Wave Passive Circuit Components and Technologies for Improvement of Characteristics)
Category: 
Keyword: 
microwaveresinPCBbalunBPFlossintegration
 Summary | Full Text:PDF(1.4MB)

Parametric Design for Resin Self-Alignment Capability
Jong-Min KIM Kozo FUJIMOTO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2003/10/01
Vol. E86-C  No. 10 ; pp. 2129-2136
Type of Manuscript:  PAPER
Category: Electronic Components
Keyword: 
joint geometryMEMSresinself-alignmentsurface tensionOE-MCMs
 Summary | Full Text:PDF(1.4MB)

Self-Alignment Process Using Liquid Resin for Assembly of Electronic or Optoelectronic Devices
Kozo FUJIMOTO Jong-Min KIM Shuji NAKATA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2001/12/01
Vol. E84-C  No. 12 ; pp. 1967-1974
Type of Manuscript:  PAPER
Category: Optoelectronics
Keyword: 
joint geometryresinself-alignmentsurface tensionOE-MCMs
 Summary | Full Text:PDF(1.6MB)