Keyword : redundant via


Rule-Based Redundant Via-Aware Standard Cell Design Considering Multiple Via Configuration
Tsang-Chi KAN Ying-Jung CHEN Hung-Ming HONG Shanq-Jang RUAN 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2014/02/01
Vol. E97-A  No. 2 ; pp. 597-605
Type of Manuscript:  PAPER
Category: VLSI Design Technology and CAD
Keyword: 
design for manufacturability (DFM)layoutredundant viastandard cell (SC)
 Summary | Full Text:PDF(3.6MB)

Redundant via Insertion: Removing Design Rule Conflicts and Balancing via Density
Song CHEN Jianwei SHEN Wei GUO Mei-Fang CHIANG Takeshi YOSHIMURA 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2010/12/01
Vol. E93-A  No. 12 ; pp. 2372-2379
Type of Manuscript:  Special Section PAPER (Special Section on VLSI Design and CAD Algorithms)
Category: Physical Level Design
Keyword: 
redundant viadouble viadesign for manufacturabilityvia density
 Summary | Full Text:PDF(1.2MB)

Practical Redundant-Via Insertion Method Considering Manufacturing Variability and Reliability
Yuji TAKASHIMA Kazuyuki OOYA Atsushi KUROKAWA 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2009/12/01
Vol. E92-A  No. 12 ; pp. 2962-2970
Type of Manuscript:  Special Section PAPER (Special Section on VLSI Design and CAD Algorithms)
Category: Physical Level Desing
Keyword: 
redundant viamanufacturing variabilityreliability
 Summary | Full Text:PDF(490.8KB)