Keyword : power bus stack and modeling


Modeling and Simulation of Via-Connected Power Bus Stacks in Multilayer PCBs
Zhi Liang WANG Osami WADA Takashi HARADA Takahiro YAGUCHI Yoshitaka TOYOTA Ryuji KOGA 
Publication:   IEICE TRANSACTIONS on Communications
Publication Date: 2005/08/01
Vol. E88-B  No. 8 ; pp. 3176-3181
Type of Manuscript:  Special Section PAPER (Special Section of 2004 International Symposium on Electromagnetic Compatibility)
Category: Printed Circuit Boards
Keyword: 
power bus stack and modelingcavity-mode modelvia interconnectEMI
 Summary | Full Text:PDF(803.3KB)