Keyword : piezoelectric


Post-Packaging Simulation Based on MOSFET Characteristics Variations Due to Resin-Molded Encapsulation
Naohiro UEDA Hirobumi WATANABE 
Publication:   
Publication Date: 2020/06/01
Vol. E103-C  No. 6 ; pp. 317-323
Type of Manuscript:  PAPER
Category: Ultrasonic Electronics
Keyword: 
stresspiezoelectricpackagesimulationSPICE
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Deposition of Polymeric Thin Films by Ionization-Assisted Method
Hiroaki USUI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2000/07/25
Vol. E83-C  No. 7 ; pp. 1128-1133
Type of Manuscript:  INVITED PAPER (Special Issue on Organic Molecular Electronics for the 21st Century)
Category: Thin Film
Keyword: 
ionization-assisted depositiondeposition polymerizationpiezoelectricorganic LED
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Piezoelectric Ceramic Transformer for Power Supply Operating in Thickness Extensional Vibration Mode
Osamu OHNISHI Yasuhiro SASAKI Toshiyuki ZAITSU Hiromi KISHIE Takeshi INOUE 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 1994/12/25
Vol. E77-A  No. 12 ; pp. 2098-2105
Type of Manuscript:  PAPER
Category: Ultrasonics
Keyword: 
piezoelectricceramictransformerthickness extensional vibrationDC-DC converterhigh frequency switchingpower supply
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