| Keyword : packaging
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300-GHz Microstrip-to-Waveguide Transition on a Polyimide Substrate Integrated with an LTCC Substrate Integrated Waveguide Takuro TAJIMA Ho-Jin SONG Makoto YAITA | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 2015/12/01
Vol. E98-C
No. 12 ;
pp. 1120-1127
Type of Manuscript:
Special Section PAPER (Special Section on Terahertz Waves Coming to the Real World)
Category: Keyword: terahertz, transition, packaging, LTCC, | | Summary | Full Text:PDF(1.2MB) | |
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InP-Based Lightwave Communication ICs for 40 Gbit/s and Beyond Eiichi SANO Yasuro YAMANE | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 1999/11/25
Vol. E82-C
No. 11 ;
pp. 1879-1885
Type of Manuscript:
INVITED PAPER (Special Issue on High-Frequency/High-Speed Devices for Information and Communication Systems in the 21st Century)
Category: Information and Communication System Keyword: InP, HEMT, analog IC, digital IC, packaging, | | Summary | Full Text:PDF(2MB) | |
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