Keyword : packaging

High-Frequency and Integrated Design Based on Flip-Chip Interconnection Technique (Hi-FIT) for High-Speed (>100 Gbaud) Optical Devices
Shigeru KANAZAWA Hiroshi YAMAZAKI Yuta UEDA Wataru KOBAYASHI Yoshihiro OGISO Johsuke OZAKI Takahiko SHINDO Satoshi TSUNASHIMA Hiromasa TANOBE Atsushi ARARATAKE 
Publication:   
Publication Date: 2019/04/01
Vol. E102-C  No. 4 ; pp. 340-346
Type of Manuscript:  INVITED PAPER (Special Section on Progress in Optical Device Technology for Increasing Data Transmission Capacity)
Category: 
Keyword: 
flip-chip, EA-DFB laser, Mach-Zehnder modulator, packaging, 
 Summary | Full Text:PDF(1.9MB)
300-GHz Microstrip-to-Waveguide Transition on a Polyimide Substrate Integrated with an LTCC Substrate Integrated Waveguide
Takuro TAJIMA Ho-Jin SONG Makoto YAITA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2015/12/01
Vol. E98-C  No. 12 ; pp. 1120-1127
Type of Manuscript:  Special Section PAPER (Special Section on Terahertz Waves Coming to the Real World)
Category: 
Keyword: 
terahertz, transition, packaging, LTCC, 
 Summary | Full Text:PDF(1.2MB)
InP-Based Lightwave Communication ICs for 40 Gbit/s and Beyond
Eiichi SANO Yasuro YAMANE 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1999/11/25
Vol. E82-C  No. 11 ; pp. 1879-1885
Type of Manuscript:  INVITED PAPER (Special Issue on High-Frequency/High-Speed Devices for Information and Communication Systems in the 21st Century)
Category: Information and Communication System
Keyword: 
InP, HEMT, analog IC, digital IC, packaging, 
 Summary | Full Text:PDF(2MB)
Innovative Packaging and Fabrication Concept for a 28 GHz Communication Front-End
Wolfgang MENZEL Jurgen KASSNER Uhland GOEBEL 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1999/11/25
Vol. E82-C  No. 11 ; pp. 2021-2028
Type of Manuscript:  INVITED PAPER (Special Issue on High-Frequency/High-Speed Devices for Information and Communication Systems in the 21st Century)
Category: RF Assembly Technology
Keyword: 
packaging, interconnect, fabrication techniques, plastic injection molding, waveguide filters, 
 Summary | Full Text:PDF(2.5MB)