Keyword : package

Post-Packaging Simulation Based on MOSFET Characteristics Variations Due to Resin-Molded Encapsulation
Naohiro UEDA Hirobumi WATANABE 
Publication:   
Publication Date: 2020/06/01
Vol. E103-C  No. 6 ; pp. 317-323
Type of Manuscript:  PAPER
Category: Ultrasonic Electronics
Keyword: 
stress, piezoelectric, package, simulation, SPICE, 
 Summary | Full Text:PDF(1.7MB)
Recent Progress with Next Generation High-Speed Ethernet Optical Device Technology
Hiroshi ARUGA Keita MOCHIZUKI Tadashi MURAO Mizuki SHIRAO 
Publication:   
Publication Date: 2019/04/01
Vol. E102-C  No. 4 ; pp. 324-332
Type of Manuscript:  INVITED PAPER (Special Section on Progress in Optical Device Technology for Increasing Data Transmission Capacity)
Category: 
Keyword: 
Ethernet, transceiver, MSA, TOSA, ROSA, package, 
 Summary | Full Text:PDF(3.8MB)
Importance and Limitations of Modeling Parasitic Capacitance between Package and PCB for Power Bus Noise and Radiation
Umberto PAOLETTI Takashi HISAKADO Osami WADA 
Publication:   IEICE TRANSACTIONS on Communications
Publication Date: 2009/06/01
Vol. E92-B  No. 6 ; pp. 1937-1944
Type of Manuscript:  Special Section PAPER (Special Section on 3rd Pan-Pacific EMC Joint Meeting -- PPEMC'08--)
Category: 
Keyword: 
common mode, parasitic capacitance, package, simultaneous switching noise, 
 Summary | Full Text:PDF(606.9KB)
Routing of Monotonic Parallel and Orthogonal Netlists for Single-Layer Ball Grid Array Packages
Yoichi TOMIOKA Atsushi TAKAHASHI 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2006/12/01
Vol. E89-A  No. 12 ; pp. 3551-3559
Type of Manuscript:  Special Section PAPER (Special Section on VLSI Design and CAD Algorithms)
Category: Physical Design
Keyword: 
ball grid array, monotonic, single-layer, package, routing, 
 Summary | Full Text:PDF(865.5KB)
Near-Field Magnetic Measurements and Their Application to EMC of Digital Equipment
Takashi HARADA Norio MASUDA Masahiro YAMAGUCHI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2006/01/01
Vol. E89-C  No. 1 ; pp. 9-15
Type of Manuscript:  INVITED PAPER (Special Section on Near-Field and Far-Field Electromagnetic Absorption and Shielding and Related Technologies)
Category: 
Keyword: 
near field, electromagnetic compatibility, loop probe, printed circuit board, package, 
 Summary | Full Text:PDF(899.2KB)
A Compact Plastic Package with High RF Isolation by Subsidiary Inner Ground Leads
Hidetoshi ISHIDA Kazuo MIYATSUJI Tsuyoshi TANAKA Daisuke UEDA Chihiro HAMAGUCHI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1999/11/25
Vol. E82-C  No. 11 ; pp. 2044-2049
Type of Manuscript:  Special Section PAPER (Special Issue on High-Frequency/High-Speed Devices for Information and Communication Systems in the 21st Century)
Category: RF Assembly Technology
Keyword: 
package, subsidiary ground, high isolation, electromagnetic simulation, 
 Summary | Full Text:PDF(1.6MB)