Keyword : multichip module


Small Planar Packaging System Combined with Card-On-Board Packaging for High-Speed, High-Density Switching Systems
Tohru KISHIMOTO Keiichi YASUNA Hiroki OKA Katsumi KAIZU Sinichi SASAKI Yasuo KANEKO 
Publication:   IEICE TRANSACTIONS on Communications
Publication Date: 1998/10/25
Vol. E81-B  No. 10 ; pp. 1894-1902
Type of Manuscript:  PAPER
Category: Communication Systems and Transmission Equipment
Keyword: 
planar packagingcard-on-board packagingmultichip modulecoaxial ZIF connectorATM switching system
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Merging Electronics and Photonics towards the Terabit/s ATM Switching
Bruno BOSTICA Luigi LICCIARDI 
Publication:   IEICE TRANSACTIONS on Communications
Publication Date: 1998/02/25
Vol. E81-B  No. 2 ; pp. 459-465
Type of Manuscript:  Special Section PAPER (Special Issue on ATM Switching Systems for future B-ISDN)
Category: Advanced technologies for ATM system
Keyword: 
ATM switchingterabit/s capacityelectronic switchingATM switching fabricphotonic switchingmultichip moduleoptical interconnections
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Heat-Pipe Cooling Technology for High-Speed ATM Switching Multichip Modules
Tohru KISHIMOTO Shinichi SASAKI Katsumi KAIZU Kouichi GENDA Kenichi ENDO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1995/05/25
Vol. E78-C  No. 5 ; pp. 564-573
Type of Manuscript:  PAPER
Category: Instrumentation and Control
Keyword: 
ATMmultichip moduleheat pipeforced air coolingthermal design
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Coaxial SMD Module Connector for High-Speed MCM
Shinichi SASAKI Tohru KISHIMOTO Nobuaki SUGIURA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1994/10/25
Vol. E77-C  No. 10 ; pp. 1575-1580
Type of Manuscript:  Special Section PAPER (Special Issue on Recent Electromechanical Devices)
Category: Connectors: Optical and Conventional
Keyword: 
quasi-coaxialsurface mount technologySMDconnectormultichip module
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Off-Chip Superconductor Wiring in Multichip Module for Josephson LSI Circuit
Shigeo TANAHASHI Takanori KUBO Ryoji JIKUHARA Gentaro KAJI Masami TERASAWA Munecazu TACANO Hiroshi NAKAGAWA Masahiro AOYAGI Itaru KUROSAWA Susumu TAKADA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1994/08/25
Vol. E77-C  No. 8 ; pp. 1157-1163
Type of Manuscript:  INVITED PAPER (Special Section on Superconducting Devices)
Category: LTS
Keyword: 
multichip modulesuperconductor wiringNb,polyimideJosephson LSI
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A New Drive Circuit Built in a Multichip Module for Supplying a Two-Phase Power to Josephson LSI Circuits
Takanori KUBO Shigeo TANAHASHI Kazuhiro KAWABATA Ryoji JIKUHARA Gentaro KAJI Masami TERASAWA Hiroshi NAKAGAWA Masahiro AOYAGI Youichi HAMAZAKI Itaru KUROSAWA Susumu TAKADA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1994/06/25
Vol. E77-C  No. 6 ; pp. 970-974
Type of Manuscript:  PAPER
Category: Superconductive Electronics
Keyword: 
multilayer ceramic substratemultichip moduleJosephson LSIa quarter wavelength stripline
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Two-Phase Thermosyphon Cooling for High-Power Multichip Modules
Tohru KISHIMOTO Akio HARADA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1994/06/25
Vol. E77-C  No. 6 ; pp. 986-994
Type of Manuscript:  PAPER
Category: Instrumentation and Control
Keyword: 
multichip modulethermosyphonheat pipethermal managementbroadband ISDN
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Optical Interconnections as a New LSI Technology
Atsushi IWATA Izuo HAYASHI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1993/01/25
Vol. E76-C  No. 1 ; pp. 90-99
Type of Manuscript:  INVITED PAPER (Special Issue on Opto-Electronics and LSI)
Category: Integration of Opto-Electronics and LSI Technologies
Keyword: 
optical interconnectionCMOS micro processorlaser diodesphoto ditectorsoptical wave guidesmultichip moduleclock circuitbus line
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