Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 2005/07/01
Vol. E88-C
No. 7 ;
pp. 1401-1405
Type of Manuscript:
Special Section PAPER (Special Section on Recent Technologies of Microwave and Millimeter-Wave Devices Focusing on Miniaturization and Advancement in Performance with Their Applications)
Category: Passive Circuits
Keyword:
multi-layered package, via-hole, coupling, mode-matching technique, |