Keyword : multi-layer

A Lightweight Radial Line Slot Antenna with Honeycomb Structure for Space Use
Hideki UEDA Jiro HIROKAWA Makoto ANDO Osamu AMANO Yukio KAMATA 
Publication:   IEICE TRANSACTIONS on Communications
Publication Date: 2008/03/01
Vol. E91-B  No. 3 ; pp. 871-877
Type of Manuscript:  PAPER
Category: Antennas and Propagation
Keyword: 
space use, lightweight, honeycomb, multi-layer, radial line slot antenna, 
 Summary | Full Text:PDF
Scalable Multi-Layer GMPLS Networks Based on Hierarchical Cloud-Routers
Daisaku SHIMAZAKI Eiji OKI Kohei SHIOMOTO Naoaki YAMANAKA 
Publication:   IEICE TRANSACTIONS on Communications
Publication Date: 2005/03/01
Vol. E88-B  No. 3 ; pp. 1119-1127
Type of Manuscript:  PAPER
Category: Network
Keyword: 
GMPLS, scalability, multi-layer, cloud router, 
 Summary | Full Text:PDF
Majority Algorithm: A Formation for Neural Networks with the Quantized Connection Weights
Cheol-Young PARK Koji NAKAJIMA 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2000/06/25
Vol. E83-A  No. 6 ; pp. 1059-1065
Type of Manuscript:  Special Section PAPER (Special Section of Papers Selected from 1999 International Technical Conference on Circuits/Systems, Computers and Communications (ITC-CSCC'99))
Category: 
Keyword: 
neural networks, multi-layer, limit cycles, quantized interconnection, parity problem, 
 Summary | Full Text:PDF
Miniaturized Millimeter-Wave Hybrid IC Technology Using Non-Photosensitive Multi-Layered BCB Thin Films and Stud Bump Bonding
Kazuaki TAKAHASHI Hiroshi OGURA Morikazu SAGAWA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1999/11/25
Vol. E82-C  No. 11 ; pp. 2029-2037
Type of Manuscript:  INVITED PAPER (Special Issue on High-Frequency/High-Speed Devices for Information and Communication Systems in the 21st Century)
Category: RF Assembly Technology
Keyword: 
millimeter wave, flip-chip bonding, stud bump, micro bump, BCB, multi-layer, 
 Summary | Full Text:PDF
Microwave Characteristics of Alumina-Glass Composite Multi-Layer Substrates with Co-fired Copper Conductors
Yutaka TAGUCHI Katsuyuki MIYAUCHI Kazuo EDA Toru ISHIDA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1993/06/25
Vol. E76-C  No. 6 ; pp. 912-918
Type of Manuscript:  Special Section PAPER (Special Issue on Microwave and Millimeter-Wave Technology for Advanced Functions and Size-Reductions)
Category: 
Keyword: 
multi-layer, microwave, alumina ceramics, copper, 
 Summary | Full Text:PDF