Keyword : multi-chip module


Development of Cryopackaging and I/O Technologies for High-Speed Superconductive Digital Systems
Yoshihito HASHIMOTO Shinichi YOROZU Yoshio KAMEDA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2008/03/01
Vol. E91-C  No. 3 ; pp. 325-332
Type of Manuscript:  INVITED PAPER (Special Section on Recent Progress in Superconductive Digital Electronics)
Category: 
Keyword: 
single flux quantumdigital integrated circuitmulti-chip modulecryopackagingMUX/DEMUXswitchsystem integration
 Summary | Full Text:PDF

OPTIMA: Scalable, Multi-Stage, 640-Gbit/s ATM Switching System Based on Advanced Electronic and Optical WDM Technologies
Naoaki YAMANAKA Eiji OKI Seisho YASUKAWA Ryusuke KAWANO Katsuhiko OKAZAKI 
Publication:   IEICE TRANSACTIONS on Communications
Publication Date: 2000/07/25
Vol. E83-B  No. 7 ; pp. 1488-1496
Type of Manuscript:  PAPER
Category: Switching
Keyword: 
ATMswitchmulti-chip moduleWDMinterconnection
 Summary | Full Text:PDF