Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 1998/06/25
Vol. E81-C
No. 6 ;
pp. 827-833
Type of Manuscript:
Special Section PAPER (Special Issue on Microwave and Millimeter-Wave Module Technology)
Category: Functional Modules and the Design Technology
Keyword:
flip-chip, micro bump bonding, millimeter-wave, HFET, HBT, |