Publication: IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2015/12/01
Vol. E98-A
No. 12 ;
pp. 2584-2591
Type of Manuscript:
Special Section PAPER (Special Section on VLSI Design and CAD Algorithms)
Category: Physical Level Design
Keyword:
TCI, ThruChip, 3-D IC, TSV, inductive coupling interface, |
