Publication: IEICE TRANSACTIONS on Communications Publication Date: 2010/07/01 Vol. E93-BNo. 7 ;
pp. 1723-1730 Type of Manuscript: Special Section PAPER (Special Section on Advanced Electromagnetic Compatibility Technology in Conjunction with Main Topics of EMC'09/Kyoto) Category: Chip and Package Level EMC Keyword: immunity, integrated circuit, EMC model, ICIM, black-box modeling, spice,
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 2008/06/01 Vol. E91-CNo. 6 ;
pp. 936-944 Type of Manuscript: Special Section PAPER (Special Section on Analog Circuits and Related SoC Integration Technologies) Category: Keyword: integrated circuit, electro magnetic interference, on-chip monitor, immunity,
Publication: IEICE TRANSACTIONS on Communications Publication Date: 2000/03/25 Vol. E83-BNo. 3 ;
pp. 569-576 Type of Manuscript: Special Section PAPER (Special Issue on Recent Progress in Electromagnetic Compatibility Technology) Category: EMC Design of PCB Keyword: immunity, suppression effect, impedance, induced voltage,
Publication: IEICE TRANSACTIONS on Communications Publication Date: 2000/03/25 Vol. E83-BNo. 3 ;
pp. 600-607 Type of Manuscript: Special Section PAPER (Special Issue on Recent Progress in Electromagnetic Compatibility Technology) Category: EMC Countermeasure Keyword: EMI, noise reduction tape, soft magnetic alloy film, electrical cable, immunity,
Publication: IEICE TRANSACTIONS on Communications Publication Date: 1997/11/25 Vol. E80-BNo. 11 ;
pp. 1620-1624 Type of Manuscript: Special Section PAPER (Special Issue on EMC Implications of Densely Mounted Electronic Devices) Category: Keyword: equipment housing, aperture, electromagnetic field analysis, the TLM method, immunity,