Keyword : hybrid integration


Assembly Technologies for Integrated Transmitter/Receiver Optical Sub-Assembly Modules
Keita MOCHIZUKI Tadashi MURAO Mizuki SHIRAO Yoshiyuki KAMO Nobuyuki YASUI Takahiro YOSHIMOTO Daisuke ECHIZENYA Masaya SHIMONO Hidekazu KODERA Masamichi NOGAMI Hiroshi ARUGA 
Publication:   
Publication Date: 2017/02/01
Vol. E100-C  No. 2 ; pp. 187-195
Type of Manuscript:  INVITED PAPER (Special Section on Fabrication Technologies Supporting the Photonic/Nanostructure Devices)
Category: 
Keyword: 
hybrid integrationoptical sub-assembly100 Gb/s Ethernet
 Summary | Full Text:PDF

Hybrid Integration of Visual Attention Model into Image Quality Metric
Chanho JUNG 
Publication:   IEICE TRANSACTIONS on Information and Systems
Publication Date: 2014/11/01
Vol. E97-D  No. 11 ; pp. 2971-2973
Type of Manuscript:  LETTER
Category: Image Processing and Video Processing
Keyword: 
image quality metricvisual attention (VA)hybrid integration
 Summary | Full Text:PDF

Optical Microsensors Integration Technologies for Biomedical Applications
Eiji HIGURASHI Renshi SAWADA Tadatomo SUGA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2009/02/01
Vol. E92-C  No. 2 ; pp. 231-238
Type of Manuscript:  INVITED PAPER (Special Section on Recent Advances in Integrated Photonic Devices)
Category: 
Keyword: 
microsensorshybrid integrationpassive alignmentlow temperature bondinglaser Doppler flowmetry
 Summary | Full Text:PDF

Low-Temperature Au-to-Au Bonding for LiNbO3/Si Structure Achieved in Ambient Air
Ryo TAKIGAWA Eiji HIGURASHI Tadatomo SUGA Satoshi SHINADA Tetsuya KAWANISHI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2007/01/01
Vol. E90-C  No. 1 ; pp. 145-146
Type of Manuscript:  Special Section LETTER (Special Section on Microoptomechatronics)
Category: Micro/Nano Fabrication
Keyword: 
low-temperature bondingAu-to-Au bondingsurface-activated bondinglithium niobate/silicon structurehybrid integration
 Summary | Full Text:PDF

Novel Stacked Packaging Structure Using Silica-Based PLC with Integrated Micro-Mirrors and Its Application to 8ch PD Array Module
Ikuo OGAWA Makoto ABE Yoshiyuki DOI Senichi SUZUKI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2005/08/01
Vol. E88-C  No. 8 ; pp. 1552-1558
Type of Manuscript:  Special Section PAPER (Special Section on Recent Development of Electro-Mechanical Devices--Selected Papers from International Session on Electro-Mechanical Devices 2004 (IS-EMD2004)--)
Category: Optical Interconnection
Keyword: 
silica-based PLCmicro-mirrorstacked packaginghybrid integration
 Summary | Full Text:PDF

Hybrid-Integrated Smart Pixels for Dense Optical Interconnects
Hiroyuki TSUDA Tatsushi NAKAHARA Takashi KUROKAWA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2001/12/01
Vol. E84-C  No. 12 ; pp. 1771-1777
Type of Manuscript:  Special Section PAPER (Special Issue on Integrated Systems with New Concepts)
Category: 
Keyword: 
smart pixeloptical interconnecthybrid integrationCMOSVCSEL
 Summary | Full Text:PDF

Polarization Insensitive SOA-PLC Hybrid Integrated Michelson Interferometric Wavelength Converter and Its Application to DWDM Networks
Rieko SATO Toshio ITO Katsuaki MAGARI Akira OKADA Manabu OGUMA Yasumasa SUZAKI Yoshihiro KAWAGUCHI Yasuhiro SUZUKI Akira HIMENO Noboru ISHIHARA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2001/05/01
Vol. E84-C  No. 5 ; pp. 571-578
Type of Manuscript:  Special Section PAPER (Joint Special Issue on Recent Progress in Optoelectronics and Communications)
Category: Optical Systems and Technologies
Keyword: 
wavelength conversioncross-phase modulationITU-T gridhybrid integrationpolarization insensitive
 Summary | Full Text:PDF

Polarization Insensitive SOA-PLC Hybrid Integrated Michelson Interferometric Wavelength Converter and Its Application to DWDM Networks
Rieko SATO Toshio ITO Katsuaki MAGARI Akira OKADA Manabu OGUMA Yasumasa SUZAKI Yoshihiro KAWAGUCHI Yasuhiro SUZUKI Akira HIMENO Noboru ISHIHARA 
Publication:   IEICE TRANSACTIONS on Communications
Publication Date: 2001/05/01
Vol. E84-B  No. 5 ; pp. 1197-1204
Type of Manuscript:  Special Section PAPER (Joint Special Issue on Recent Progress in Optoelectronics and Communications)
Category: Optical Systems and Technologies
Keyword: 
wavelength conversioncross-phase modulationITU-T gridhybrid integrationpolarization insensitive
 Summary | Full Text:PDF

Hybrid External Cavity Lasers Composed of Spot-Size Converter Integrated LDs and UV Written Bragg Gratings in a Planar Lightwave Circuit on Si
Takuya TANAKA Hiroshi TAKAHASHI Yoshinori HIBINO Toshikazu HASHIMOTO Akira HIMENO Yasufumi YAMADA Yuichi TOHMORI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2000/06/25
Vol. E83-C  No. 6 ; pp. 875-883
Type of Manuscript:  Special Section PAPER (Special Issue on Advanced Optical Devices for Next Generation High-Speed Communication Systems and Photonic Networks)
Category: WDM Network Devices
Keyword: 
external cavity laserhybrid integrationgratingmultiwavelength laserPLC
 Summary | Full Text:PDF

1.3/1.55-µm Full-Duplex WDM Optical Transceiver Modules for ATM-PON (PDS) Systems Using PLC-Hybrid-Integration and CMOS-IC Technologies
Takeshi KUROSAKI Toshikazu HASHIMOTO Noboru ISHIHARA Yasuhiro SUZUKI Masahiro YANAGISAWA Hideaki KIMURA Makoto NAKAMURA Yuichi TOHMORI Kazutoshi KATO Yoshihiro KAWAGUCHI Yuji AKAHORI Yasufumi YAMADA Kuniharu KATO Hiromu TOBA Junichi YOSHIDA 
Publication:   IEICE TRANSACTIONS on Communications
Publication Date: 1999/08/25
Vol. E82-B  No. 8 ; pp. 1199-1208
Type of Manuscript:  Special Section PAPER (Joint Special Issue on Recent Progress in Optoelectronics and Communications)
Category: Optical Active Devices and Modules
Keyword: 
optical transceiver modulePLChybrid integrationCMOS ICATM PONfull-duplex operation
 Summary | Full Text:PDF

A 1.55-µm Hybrid Integrated Wavelength-Converter Module Using Spot-Size Converter Integrated Semiconductor Optical Amplifiers on a Planar-Lightwave-Circuit Platform
Rieko SATO Yasuhiro SUZUKI Naoto YOSHIMOTO Ikuo OGAWA Toshikazu HASHIMOTO Toshio ITO Akio SUGITA Yuichi TOHMORI Hiromu TOBA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1999/08/25
Vol. E82-C  No. 8 ; pp. 1487-1493
Type of Manuscript:  Special Section PAPER (Joint Special Issue on Recent Progress in Optoelectronics and Communications)
Category: Optical Active Devices and Modules
Keyword: 
hybrid integrationspot-size converter integrated semiconductor optical amplifierplanar-lightwave-circuit platformwavelength conversiontemperature dependence
 Summary | Full Text:PDF

A 1.55-µm Hybrid Integrated Wavelength-Converter Module Using Spot-Size Converter Integrated Semiconductor Optical Amplifiers on a Planar-Lightwave-Circuit Platform
Rieko SATO Yasuhiro SUZUKI Naoto YOSHIMOTO Ikuo OGAWA Toshikazu HASHIMOTO Toshio ITO Akio SUGITA Yuichi TOHMORI Hiromu TOBA 
Publication:   IEICE TRANSACTIONS on Communications
Publication Date: 1999/08/25
Vol. E82-B  No. 8 ; pp. 1221-1227
Type of Manuscript:  Special Section PAPER (Joint Special Issue on Recent Progress in Optoelectronics and Communications)
Category: Optical Active Devices and Modules
Keyword: 
hybrid integrationspot-size converter integrated semiconductor optical amplifierplanar-lightwave-circuit platformwavelength conversiontemperature dependence
 Summary | Full Text:PDF

1.3/1.55-µm Full-Duplex WDM Optical Transceiver Modules for ATM-PON (PDS) Systems Using PLC-Hybrid-Integration and CMOS-IC Technologies
Takeshi KUROSAKI Toshikazu HASHIMOTO Noboru ISHIHARA Yasuhiro SUZUKI Masahiro YANAGISAWA Hideaki KIMURA Makoto NAKAMURA Yuichi TOHMORI Kazutoshi KATO Yoshihiro KAWAGUCHI Yuji AKAHORI Yasufumi YAMADA Kuniharu KATO Hiromu TOBA Junichi YOSHIDA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1999/08/25
Vol. E82-C  No. 8 ; pp. 1465-1474
Type of Manuscript:  Special Section PAPER (Joint Special Issue on Recent Progress in Optoelectronics and Communications)
Category: Optical Active Devices and Modules
Keyword: 
optical transceiver modulePLChybrid integrationCMOS ICATM PONfull-duplex operation
 Summary | Full Text:PDF

Assembly and Electrical Wiring Technologies on Planar Lightwave Circuit (PLC) Platform Providing Hybrid Integration of Optoelectronic Devices and Integrated Circuits (ICs)
Takaharu OHYAMA Yuji AKAHORI Masahiro YANAGISAWA Hideki TSUNETSUGU Shinji MINO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1999/02/25
Vol. E82-C  No. 2 ; pp. 370-378
Type of Manuscript:  Special Section PAPER (Joint Special Issue on Photonics in Switching: Systems and Devices)
Category: Assembly and Packaging Technologies
Keyword: 
PLC platformhybrid integrationsolder bumpflip-chip bondingmicrostrip line
 Summary | Full Text:PDF

Assembly and Electrical Wiring Technologies on Planar Lightwave Circuit (PLC) Platform Providing Hybrid Integration of Optoelectronic Devices and Integrated Circuits (ICs)
Takaharu OHYAMA Yuji AKAHORI Masahiro YANAGISAWA Hideki TSUNETSUGU Shinji MINO 
Publication:   IEICE TRANSACTIONS on Communications
Publication Date: 1999/02/25
Vol. E82-B  No. 2 ; pp. 422-430
Type of Manuscript:  Special Section PAPER (Joint Special Issue on Photonics in Switching: Systems and Devices)
Category: Assembly and Packaging Technologies
Keyword: 
PLC platformhybrid integrationsolder bumpflip-chip bondingmicrostrip line
 Summary | Full Text:PDF

Low-Cost Hybrid WDM Module Consisting of a Spot-Size Converter Integrated Laser Diode and a Waveguide Photodiode on a PLC Platform for Access Network Systems
Naoto UCHIDA Yasufumi YAMADA Yoshinori HIBINO Yasuhiro SUZUKI Noboru ISHIHARA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1997/01/25
Vol. E80-C  No. 1 ; pp. 88-97
Type of Manuscript:  INVITED PAPER (Special Issue on Devices, Packaging Technology, and Subsystems for the Optical Access Network)
Category: Module and packaging technology
Keyword: 
optical modulehybrid integrationplanar lightwave circuitlarge spot-size laser diodepassive alignmentaccess network
 Summary | Full Text:PDF

High Responsivity, Low Dark Current, and Highly Reliable Operation of InGaAlAs Waveguide Photodiodes for Optical Hybrid Integration
Hitoshi NAKAMURA Masato SHISHIKURA Shigehisa TANAKA Yasunobu MATSUOKA Tsunao ONO Takao MIYAZAKI Shinji TSUJI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1997/01/25
Vol. E80-C  No. 1 ; pp. 41-46
Type of Manuscript:  Special Section PAPER (Special Issue on Devices, Packaging Technology, and Subsystems for the Optical Access Network)
Category: 
Keyword: 
optical accessoptical platformhybrid integrationplanar lightwave circuitwaveguide photodiodephotodiodemolecular beam epitaxypassivationreliability
 Summary | Full Text:PDF