Keyword : hybrid IC

Miniaturized Front-End HIC Using MBB Technology for Mobile Communication Equipment
Junji ITOH Tadayoshi NAKATSUKA Takayuki YOSHIDA Mitsuru NISHITSUJI Tomoya UDA Osamu ISHIKAWA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1998/06/25
Vol. E81-C  No. 6 ; pp. 834-840
Type of Manuscript:  Special Section PAPER (Special Issue on Microwave and Millimeter-Wave Module Technology)
Category: Functional Modules and the Design Technology
Keyword: 
mobile communication, front-end, down-converter, GaAs, hybrid IC, 
 Summary | Full Text:PDF(788.1KB)
Copper Thick Film Conductor for Aluminum Nitride Substrates
Tsuneo ENDOH Yasutoshi KURIHARA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1996/06/25
Vol. E79-C  No. 6 ; pp. 845-852
Type of Manuscript:  PAPER
Category: Electronic Circuits
Keyword: 
hybrid IC, ceramics, aluminum nitride, thick-film, copper conductor, 
 Summary | Full Text:PDF(1.2MB)
Low-Power Technology for GaAs Front-End ICs
Tadayoshi NAKATSUKA Junji ITOH Kazuaki TAKAHASHI Hiroyuki SAKAI Makoto TAKEMOTO Shinji YAMAMOTO Kazuhisa FUJIMOTO Morikazu SAGAWA Osamu ISHIKAWA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1995/04/25
Vol. E78-C  No. 4 ; pp. 430-435
Type of Manuscript:  Special Section PAPER (Special Issue on Low-Voltage, Low-Power Integrated Circuits)
Category: Analog Circuits
Keyword: 
mobile communication, front-end, down-converter, up-converter, GaAs IC, hybrid IC, low-power consumption, 
 Summary | Full Text:PDF(686.3KB)