Keyword : heterogeneous integration

Room-Temperature Bonding of Wafers with Smooth Au Thin Films in Ambient Air Using a Surface-Activated Bonding Method
Eiji HIGURASHI Ken OKUMURA Yutaka KUNIMUNE Tadatomo SUGA Kei HAGIWARA 
Publication:   
Publication Date: 2017/02/01
Vol. E100-C  No. 2 ; pp. 156-160
Type of Manuscript:  INVITED PAPER (Special Section on Fabrication Technologies Supporting the Photonic/Nanostructure Devices)
Category: 
Keyword: 
heterogeneous integration, room-temperature bonding, surface-activated bonding, Au-Au bonding, 
 Summary | Full Text:PDF
Room-Temperature Gold-Gold Bonding Method Based on Argon and Hydrogen Gas Mixture Atmospheric-Pressure Plasma Treatment for Optoelectronic Device Integration
Eiji HIGURASHI Michitaka YAMAMOTO Takeshi SATO Tadatomo SUGA Renshi SAWADA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2016/03/01
Vol. E99-C  No. 3 ; pp. 339-345
Type of Manuscript:  INVITED PAPER (Special Section on Progress towards System Nanotechnology)
Category: 
Keyword: 
heterogeneous integration, low-temperature bonding, surface-activated bonding, atmospheric-pressure plasma, optical microsystems, 
 Summary | Full Text:PDF
Fabrication of InP/InGaAs SHBT on Si Substrate by Using Transferred Substrate Process
Yutaro YAMAGUCHI Takeshi SAGAI Yasuyuki MIYAMOTO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2012/08/01
Vol. E95-C  No. 8 ; pp. 1323-1326
Type of Manuscript:  BRIEF PAPER
Category: III-V High-Speed Devices and Circuits
Keyword: 
heterojunction bipolar transistor, InP, base-collector capacitance, transferred-substrate, heterogeneous integration, 
 Summary | Full Text:PDF
A GaAs SOI HEMT Fabricated by Fluidic Self-Assembly and Its Application to an RF-Switch
Koichi MAEZAWA Ikuo SOGA Shigeru KISHIMOTO Takashi MIZUTANI Kazuhiro AKAMATSU 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2008/07/01
Vol. E91-C  No. 7 ; pp. 1025-1030
Type of Manuscript:  Special Section PAPER (Special Section on Heterostructure Microelectronics with TWHM 2007)
Category: Novel Integration Technology
Keyword: 
heterogeneous integration, fluidic self-assembly, HEMT, SPDT switch, SOI, 
 Summary | Full Text:PDF
Field Configurable Self-Assembly: A New Heterogeneous Integration Technology
Alan O'RIORDAN Gareth REDMOND Thierry DEAN Mathias PEZ 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2003/10/01
Vol. E86-C  No. 10 ; pp. 1977-1984
Type of Manuscript:  INVITED PAPER (Special Issue on Heterostructure Microelectronics with TWHM2003)
Category: 
Keyword: 
heterogeneous integration, self-assembly, programmable force fields, collective wiring, 
 Summary | Full Text:PDF