Publication: Publication Date: 2019/04/01 Vol. E102-CNo. 4 ;
pp. 340-346 Type of Manuscript: INVITED PAPER (Special Section on Progress in Optical Device Technology for Increasing Data Transmission Capacity) Category: Keyword: flip-chip, EA-DFB laser, Mach-Zehnder modulator, packaging,
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 2008/07/01 Vol. E91-CNo. 7 ;
pp. 1098-1103 Type of Manuscript: Special Section PAPER (Special Section on Heterostructure Microelectronics with TWHM 2007) Category: GaAs- and InP-Based Devices Keyword: Gunn VCO, flip-chip, millimeter-wave, tuning-frequency range, laser micromachining,
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 1998/06/25 Vol. E81-CNo. 6 ;
pp. 827-833 Type of Manuscript: Special Section PAPER (Special Issue on Microwave and Millimeter-Wave Module Technology) Category: Functional Modules and the Design Technology Keyword: flip-chip, micro bump bonding, millimeter-wave, HFET, HBT,
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 1998/06/25 Vol. E81-CNo. 6 ;
pp. 810-818 Type of Manuscript: INVITED PAPER (Special Issue on Microwave and Millimeter-Wave Module Technology) Category: Functional Modules and the Design Technology Keyword: flip-chip, bump, HIC (Hybrid IC), microwave, millimeter-wave,
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 1995/08/25 Vol. E78-CNo. 8 ;
pp. 971-978 Type of Manuscript: Special Section PAPER (Special Issue on Microwave and Millimeter-Wave Technology) Category: Keyword: millimeter-wave, flip-chip, IC (Integrated Circuit), microstrip line, bump,
