Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 1994/02/25
Vol. E77-C
No. 2 ;
pp. 139-147
Type of Manuscript:
Special Section PAPER (Special Issue on 1993 VLSI Process and Device Modeling Workshop (VPAD 93))
Category: Device Modeling
Keyword:
TCAD, device simulation, hot-electron effects, electro-thermal effects, |
