Keyword : dummy fill

Eigenmode Analysis of Propagation Constant for a Microstrip Line with Dummy Fills on a Si CMOS Substrate
Yuya ONO Takuichi HIRANO Kenichi OKADA Jiro HIROKAWA Makoto ANDO 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2011/06/01
Vol. E94-C  No. 6 ; pp. 1008-1015
Type of Manuscript:  Special Section PAPER (Special Section on Analog Circuits and Related SoC Integration Technologies)
Category: 
Keyword: 
silicon CMOS, microstrip line, propagation constant, dummy fill, eigenmode analysis, periodic structure, millimeter wave, 
 Summary | Full Text:PDF
Dummy Fill Aware Buffer Insertion after Layer Assignment Based on an Effective Estimation Model
Yanming JIA Yici CAI Xianlong HONG 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2008/12/01
Vol. E91-A  No. 12 ; pp. 3783-3792
Type of Manuscript:  PAPER
Category: VLSI Design Technology and CAD
Keyword: 
VLSI, buffer insertion, physical design, DFM, dummy fill, 
 Summary | Full Text:PDF
Formula-Based Method for Capacitance Extraction of Interconnects with Dummy Fills
Atsushi KUROKAWA Akira KASEBE Toshiki KANAMOTO Yun YANG Zhangcai HUANG Yasuaki INOUE Hiroo MASUDA 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2006/04/01
Vol. E89-A  No. 4 ; pp. 847-855
Type of Manuscript:  Special Section PAPER (Special Section on Selected Papers from the 18th Workshop on Circuits and Systems in Karuizawa)
Category: 
Keyword: 
dummy fill, capacitance extraction, capacitance formula, interconnect, 
 Summary | Full Text:PDF
Efficient Dummy Filling Methods to Reduce Interconnect Capacitance and Number of Dummy Metal Fills
Atsushi KUROKAWA Toshiki KANAMOTO Tetsuya IBE Akira KASEBE Wei Fong CHANG  Tetsuro KAGE Yasuaki INOUE Hiroo MASUDA 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2005/12/01
Vol. E88-A  No. 12 ; pp. 3471-3478
Type of Manuscript:  Special Section PAPER (Special Section on VLSI Design and CAD Algorithms)
Category: Interconnect
Keyword: 
dummy metal, dummy fill, interconnect capacitance, CMP, 
 Summary | Full Text:PDF
A Practical Approach for Efficiently Extracting Interconnect Capacitances with Floating Dummy Fills
Atsushi KUROKAWA Toshiki KANAMOTO Akira KASEBE Yasuaki INOUE Hiroo MASUDA 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2005/11/01
Vol. E88-A  No. 11 ; pp. 3180-3187
Type of Manuscript:  PAPER
Category: VLSI Design Technology and CAD
Keyword: 
dummy fill, dummy metal, capacitance extraction, interconnect capacitance, 
 Summary | Full Text:PDF