Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 1994/08/25
Vol. E77-C
No. 8 ;
pp. 1395-1403
Type of Manuscript:
Special Section PAPER (Special Section on High Speed and High Density Multi Functional LSI Memories)
Category: General Technology
Keyword:
BiCMOS, bonded SOI, double polysilicon bipolar, trench isolation, stress, |
